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Introduction to Micro-electro-mechanical systems (MEMS)


By Aida Yoguely
November 15, 2015

Here are photos from my MEMS device fabrication process.

 

Behind The Scene

Behind The Scene

Behind The Scene

Behind The Scene

Behind The Scene

Behind The Scene

Behind The Scene

Topics

    Course Outline
     Introduction and scaling laws
     Introduction to lithography
     Mask aligner and imaging optics
     Resolution in photolithography and mask layout
     Structure of silicon and properties
     Oxidation and diffusion
     Nucelation and growth
     Evaporation and Sputtering
     CVD and PECVD
     Atomic Layer Deposition
     Polysilicon
     Wet etching
     Surface micromachining
     Bulk micromachining processes
     Corner compensation and etch stop
     Vacuum physics and kinetic theory
     Plasma and Deep RIE etching
     Characterization Methods
     PDMS and SU-8 MEMS processing
     Stereolithography
     Wafer anodic bonding and local bonding
     Electroplating metals
     MEMS/NEMS Sensors
     Microcantilever Fabrication Processes

     

    LABORATORY EXPERIMENTS FOR MEMS CLASS
     Lab safety and clean room protocol
     CAD and Mask Making
     Photolithography
     Etching and Bulk Micromachining
     Metal deposition
     Characterization Methods
     BioMEMS Device Molding
     Anodic bonding & MEMS Packaging (optional

ME 6229 course taken at the Georgia Institute of Technology.

Strategy

Lesson Learned: Choose classes you are interested in learning.

Course Materials